Device Modelling Engineer (m/f/d)
Dresden, Germany
Job description
- Characterization and modeling of semiconductor devices
- On-wafer measurements in our process characterization lab facilities
- Model extractions from measured data (BSIM, Hi-SIM, JUNCAP2, DIODE-CMC, etc.)
- Matching and noise characterization and modeling
- Continuous development and maintenance of our characterization/modeling infrastructures (Hardware/Software)
Job requirements
- Degree in electronics engineering, microelectronics, or equivalent discipline, ideally with validated years of experience, but we are open to junior applicants too.
- Experience with tools like ICCAP, Cadence, etc. beneficial
- Basic programing skills expected (Python knowledge beneficial), necessary trainings can/will be offered
- Willingness to learn and to be trained on most innovative and diverse semiconductor technologies/devices
- Good communication skills in English and ability to work on a multidisciplinary environment
Your advantages
- Collective bargaining agreement including collectively agreed special payments and leaves of absence
- Employee discounts (corporate benefits, home improvement discount)
- Own Linked In Learning-Account
- Recognition and financial compensation for patent applications (R&D)
- Company pension plan
- Retirement leave
- Financial support in case of child sick leave - Full salary payment for up to 2 days per illness
- Time off within the scope of the applicable collective bargaining agreement
- Additional payment for meals in the company canteen
- Flexible working time
- Mobile working
- Further training opportunities
- Continued payment of wages in case of illness
- Free parking and good connections to the public transport network
- Special bonus for company anniversaries
- Free provision of coffee, water, tea
- Company celebrations
Application info
Send your application (preferably via Email) including your availability and your salary expectations to:
Contact person:
Katharina Oedemann
or online at:
HR-Dresden(at)xfab.com