The X-FAB Group - about 4,000 employees - is the leading analog/mixed-signal foundry manufacturing silicon wafers for analog-digital integrated circuits (mixed-signal ICs). X-FAB customers benefit from high-performance technologies, excellent technical design and prototyping services; and fast, easy and flexible foundry access worldwide.
Process Development Engineer (m/f) Image Sensors Pixel Design
X-FAB is looking for a development engineer with CMOS image sensors experience to join our Process Development team, based in Erfurt (Ger) or Dresden (Ger) or Corbeil-Essonnes (Fr) or Plymouth (UK) for working as part of an international organization developing mixed signal CMOS technologies.
- Image sensor pixel design.
- Image sensor test chip design and measurement.
- Offer technical support to customers.
- Cooperation with external partners.
- Management of development projects, working in interdisciplinary and international teams.
- Qualification: Bachelor Degree / Master of Engineering in Material Science, Physics, Microelectronics or related subject. PhD desirable.
- Experience: Minimum 3 years of experience or PhD in CMOS image sensors.
- Willingness to travel and ability to work effectively in multicultural international team
- Self motivated
- Good technical leadership and organizing abilities
- Able to meet deadlines
- Good problem-solving skills
- Excellent English language and communication skills
Technical /Functional Competencies:
- Hands-on experience on CMOS image sensors, including pixel and CMOS image sensor design, testing / characterisation.
- Good understanding of Semiconductor device physics.
- Knowledge or experience to function, fabrication and characterisation of semiconductor devices.
- Understanding of design rules and the impact of device characteristics on product performance.
- Experience in project work.
We are looking forward to get your application soon (preferably by e-mail)!
Please submit your application in English.
Contact person: Marion Heidolf
or online at: HR-Erfurt(at)xfab.com
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