Staff Engineer - Process Development (HV)

Kuching, Malaysia

Your Role

To support Process Development Manager and implement process development job in development and Transfer projects, sustaining the required physical/electrical target in semiconductor chip at competitive yield and integrating overall process to meet the target.
MBO:
- To plan, develop and implement individual/group development plan to meet Technology Goal.
Technology Development & Transfer
- Acquire from our technology partner (internal/external) the knowledge necessary for the successful transfer or development of technology.
- Lead the development of new processes and products based on customers’ need.
- Coordinate available resources from the process engineering, product engineering, FA, and manufacturing group in troubleshooting, resolving issues, process improvement, and yield enhancement.
- Enhance the yield and reliability of the acquired technology and process.
- DOE design for technology optimization.
- Follow up the customer lots.
- Transfer developed process to Operation (internal/external) and support stabilization.

EHS & Quality
- To contribute towards the achievement of quality objectives by complying to the quality operating system and participating in continuous improvement activities (defect prevention, reduction of variation or prevention of waste).
- To contribute towards the achievement of the EHS objectives by complying to the EHS policy and participating in the implementation of EHS management system
Any other assignment deems fit that shall be given to you from time to time.

Your Profile

Qualification: bachelor’s degree or higher in Engineering / Science
Experience: Preferably with minimum of 3 years of working experience in semiconductor device physics & process integration.
Skills/Competencies:
- Behavioral Competencies
  - Excellent communication/presentation skills
  - Good leadership and organizing abilities
- Technical/ Functional Competencies
  - Basic knowledge of semiconductor physics and device. (Transistor, Resistor, Capicitor)
  - Experiences on 180nm to 110nm Aluminum - Based BEOL integration
  - Experience and knowledge on MIM, MOM, ILD, IMD, Passivation, Borderless Via, Bond Pad, Circuit Under Pad.
  - Experience on Cu BEOL (Preferred)
  - Knowledge on Wire Bonding and Advanced Package (Preferred)
  - Job view for GDS data and MEBES data
  - Understanding on the procedure of the development and transfer
  - Basic knowledge of reliability (EM, SM, TDDB, HCI, NBTI, HTOL)
  - Computer literacy in Microsoft Excel, Word, PowerPoint and Outlook.

Contact person : Kristina Sim