At X-FAB we combine solid, specialized expertise in advanced analog and mixed-signal process technologies with excellent service, a high level of responsiveness and first-class technical support.
We offer our customers a broad spectrum of process technologies and sufficient manufacturing capacity (100,000 wafer starts per month) to serve the growing demand for analog/mixed-signal applications. Our wafers are manufactured based on advanced modular CMOS and SOI processes with technologies ranging from 1.0 down to 0.13 micrometer. In addition, we offer special-purpose technologies such as SiC and MEMS processes.
The products that are manufactured with X-FAB technologies are typically used in the following application areas:
When joining X-FAB as an employee, you will learn about the fascinating range of applications that we serve.
Just to mention a few examples: You can find our microchips made at X-FAB in the tilt sensor of your smartphone, the rain sensor of your car, the intelligent power switch for home automation, in the medical field as a large image sensor for fast X-ray solutions and in the industrial field as an optical encoder for position and length detection.
In Germany, X-FAB has a workforce of more than 1,000 highly-qualified employees. Worldwide, our X-FABulous team counts about 4,000 people. Our manufacturing sites are located all over the world:
- Erfurt (Germany)
- Dresden (Germany)
- Itzehoe (Germany)
- Corbeil-Essonnes (France)
- Kuching (Sarawak, Malaysia)
- Lubbock (Texas, USA)
With our sales offices in the USA and in key countries in Asia and Europe we ensure close contact with our customers all over the globe.